HF-S80 Series

HF-S80 Four-Axis Offline X-ray Inspection System

High-Precision Inspection | Intelligent Four-Axis Motion | Efficient Offline Inspection

Four-axis offline X-ray system for electronics and solder-structure inspection — internal defects in IPC, PCBA, BGA, semiconductors, and more.

WHY CHOOSE US

Key advantages

Combine high-resolution imaging, four-axis motion, and intelligent algorithms for more precise and efficient inspection.

High-Resolution Imaging

High-performance microfocus source and precision detector for sharper imaging

Four-Axis Motion System

Precision X/Y/Z/R motion for multi-angle inspection of complex structures

Intelligent Inspection Analysis

AI-assisted judgment to improve inspection efficiency and accuracy

Multi-Layer Safety Protection

Fully enclosed tube design with multi-interlocks and radiation shielding for safe, reliable operation

Efficient Offline Inspection

Offline programming reduces wait time and improves production efficiency

APPLICATION SCENARIOS

Applications

Internal defect inspection for a wide range of industries and products

PCBA Inspection

PCBA Inspection

Solder joints, cold joints, voids, bridges, and related defects

BGA Inspection

BGA Inspection

BGA balls, voids, bridges, and pad defects

Semiconductor Inspection

Semiconductor Inspection

Package, lead-frame, bonding, and related internal defects

Connector Inspection

Connector Inspection

Connector terminals, welds, pins, and related defects

Electronic Component Inspection

Electronic Component Inspection

Internal structure of inductors, capacitors, diodes, and similar components

TECHNICAL DATA

Technical specifications

Model
HF-S80
X-ray Source
Sealed microfocus X-ray tube
Max. Voltage
130kV
Max. Current
100μA
Detector
Flat-panel detector
Pixel Size
75 μm / 100 μm (optional)
Axes
Four-axis (X/Y/Z/R)
X/Y Travel
600mm × 600mm
Z Travel
150mm
R Rotation
± 180°
Dimensions
Approx. 1600 × 1400 × 1900 mm
Weight
Approx. 1500 kg
Technical specifications

HF-S80 is Wahfei Technology's four-axis entry offline X-ray inspection system for observing internal structure and solder condition without destroying the workpiece.

It suits offline inspection of electronics, PCBA, BGA, and similar samples — a foundation platform for quality analysis, process validation, and sample review.

Imaging configuration, workpiece size, and inspection range depend on material, thickness, and target defects. Submit sample information for tailored evaluation and selection advice.

Protecting Your Product Quality

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