BGA Solder Void Rate Inspection Methods and Best Practices

BGA joints sit under the package, so conventional visual inspection cannot see them directly. X-ray reveals internal joint condition without destroying the sample.

Focus on void distribution, joint morphology, bridging, and connection anomalies, using consistent imaging conditions and judgment rules.

Void-rate and similar measurements should align with process standards and product requirements. Software can quantify, but final acceptance criteria must be confirmed by the customer.