Semiconductor Packaging and Testing:IC chips,IGBT modules,MEMS sensors. Circuit Board Assembly(PCBA&SMT):BGA,QFN,LGA,through-holes,and FPC(flexible printed circuits). Electronic Components:electrolytic capacitors,resistors,inductors,and more.

Automotive Electronics:ECU(Electronic Control Units),sensors,and in-vehicle camera modules. Power and Lithium Batteries:cell inspection(such as electrode alignment and winding defects),weld quality analysis,and internal foreign object detection. Castings(e.g.,engine blocks,wheel hubs):porosity,shrinkage,and crack inspection. Molded Plastic Parts:internal bubbles,knit lines,and insert positioning analysis.

5G-Related Devices:optical modules,high-speed connectors,filters,and antenna modules—inspection of internal structures and soldering quality in high-density components.

Electronic Components:connectors,sensors,and other precision parts. Composite Materials and Structural Components:detection of delamination,inclusions,and voids. Precision Castings and Welded Parts:inspection of key components such as turbine blades and disks.

Connectors:inspection of internal crimping,solder joints,and molding integrity. Wire Harness Assemblies:internal quality analysis of crimping and welding points.

Industrial Castings and Welds:non-destructive testing(NDT)for various metal castings and welded structures. New Materials:internal structure analysis of ceramics,composites,and other advanced materials.