
The Evolution of X-Ray Inspection Equipment: Witnessing the Innovative Transformation of the HF-S90
As Wahfei's most representative offline X-Ray inspection equipment, the HF-S90 has undergone four iterations over seven years. Each upgrade represents not just an improvement in appearance, but a comprehensive leap in performance, structure, and intelligence. For you, this means higher inspection accuracy, faster inspection speeds, and more stable production assurance.
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2025-11-15

Huizhou Kaiyuan Purchases X-Ray Equipment for Battery Inspection, Enhancing Quality Assurance | Case Analysis
To address the industry challenge of detecting internal defects in lithium batteries, Kaiyuan New Energy has introduced Wahfei X-Ray inspection equipment, enabling non-destructive imaging of internal battery structures, effectively reducing defect outflow rates and ensuring product safety and consistency.
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2025-11-04

X-ray Inspection Audio Chip Solder Penetration Rate Video Demonstration
X-ray Determination of Common Defects and Countermeasures: Insufficient Solder Penetration (Shallow Fill): Increase preheat, adjust wave contact angle and time, optimize hole wall cleanliness. Internal Voids/Gas Entrapment: Reduce solder gas content, optimize flux volatilization path and nitrogen protection. Eccentric Wetting: Check pin centering and fixture positioning, perform hole chamfering/expand ring width if necessary.
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2025-10-25

PCBA X-Ray Inspection Technology and Solder Defect Analysis
X-rays possess extremely strong penetrating power. Different material densities and thicknesses absorb X-rays to varying degrees. By analyzing the intensity changes of X-rays after passing through a sample, grayscale contrast images are formed to identify internal structures. Based on material density characteristics, PCBA components can be divided into four categories: tin-lead alloy solder joints (high density, appear dark in images); metal packaging shells, ceramic packaging, chips (medium density); plastic packaging materials, silicon materials (low density, appear light in images); void, crack defects and PCB vias (X-rays pass through completely, appear brightest).
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2025-10-10

Focusing on X-Ray Non-Destructive Testing | Wahfei Tech Debuts at the 19th CSDD Conference
With the accelerated adoption of third-generation semiconductors like silicon carbide (SiC) and gallium nitride (GaN), alongside the boom in new energy vehicles, photovoltaic energy storage, and AI data centers, the industry's demand for efficient and precise chip testing is continuously growing. From July 25th to 27th, 2025, the 19th China Semiconductor Discrete Devices Conference & Exhibition was held under the industry's spotlight. Wahfei Technology made a significant appearance, showcasing its independently developed full-stack X-Ray intelligent inspection solutions.
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2025-07-31
