How to Select the Right X-Ray Inspection Equipment for Your Industry?——With Parameter Comparison Table

With the rapid development of intelligent manufacturing and high-end equipment, industrial X-Ray—characterized by its non-destructive and high-precision capabilities—is widely applied in industries such as semiconductors, electronics, energy, and metal processing.

This article begins with the core parameters of X-Ray equipment and analyzes the technical features and process stages of four typical application fields one by one, helping stakeholders fully understand how to select an appropriate X-ray inspection solution.

I. Integrated Circuit Sector

Key Technical Parameters:

X-ray source focal spot size: 0.1–15 μm

Output tube voltage: ≤160 kV

Output power: ≤80 W

Tube configuration: Sealed tube / Open tube

Technical Features:

1. Ultra-small focal spot (0.1–15 μm) enables nanometer-level precision inspection, meeting the visualization requirements for the most minute structural defects;

2. Open-tube X-ray sources are the mainstream configuration; although maintenance costs are higher, they deliver superior beam intensity and imaging resolution;

3. Sealed-tube X-ray sources offer easy maintenance and are suited for medium-to-low throughput inline inspection scenarios.

Typical Process Stages:

Edge crack and foreign particle inspection after wafer dicing.

Internal solder joint and ball condition inspection in IC packaging (WLP, BGA).

II. Electronics Manufacturing Sector

Key Technical Parameters:

X-ray source focal spot size: 1–80 μm

Output tube voltage: ≤300 kV

Output power: ≤500 W

Tube configuration: Sealed tube / Open tube

Technical Features:

1. Both tube configurations achieve high-precision inspection; focal spots as small as 1 μm can capture subtle solder joint defects;

2. A small focus-to-object distance (FOD) supports high geometric magnification with strong detail-recognition capability;

3. The combination of higher voltage (≤300 kV) and power (≤500 W) penetrates thicker PCBs and metal components.

Typical Process Stages:

PCBA solder quality inspection: solder ball misalignment, cold joints, and short-circuit detection.

SMT placement quality inspection: component polarity and misalignment identification.

Internal structure and solder joint integrity inspection of automotive electronic components.

III. New Energy Battery Sector

Key Technical Parameters:

X-ray source focal spot size: 5–80 μm

Output tube voltage: ≤150 kV

Output power: ≤75 W

Tube configuration: Sealed tube

Technical Features:

1. A small focal spot (starting at 5 μm) detects micro-defects such as tab solder joints and separator damage inside battery cells;

2. Most applications are inline inspection, integrated into production lines for high-speed, continuous quality control;

3. Tube voltage ranges by battery type: 90–110 kV for consumer electronics (3C) batteries, 130–150 kV for traction batteries.

Typical Process Stages:

Internal structure and tab solder joint inspection of traction batteries (cylindrical, prismatic, pouch).

Internal electrode and separator integrity inspection of 3C batteries (smartphones, laptops).

Inline monitoring of electrolyte leakage, inclusions, and voids in energy storage batteries after assembly.

IV. Castings, Weldments, and Materials Sector

Key Technical Parameters:

X-ray source focal spot size: 400–1000 μm

Output energy: ≤450 kV

Output power: ≤4500 W

Tube configuration: Sealed tube / Open tube

Technical Features:

1. The high-voltage, high-power combination penetrates high-density metals (steel, aluminum alloy) and thick-walled castings;

2. Sealed tubes have larger focal spots and are not suited for ultra-fine inspection, but offer high stability and easy maintenance;

3. Open tubes maintain smaller focal spots even at high voltages, enabling precision inspection, albeit at higher maintenance costs.

Typical Process Stages:

Porosity and sand inclusion inspection in castings (engine blocks, gearboxes)

Crack and slag inclusion assessment in weldments (pipe welds, structural components).

Interlayer defect and porosity inspection in materials (composites, metal sheets).

From nanometer-level integrated circuits to metal castings, different application scenarios impose diverse requirements on X-Ray focal spot size, voltage, power, and tube configuration.

Selecting the right combination of parameters balances inspection precision with production efficiency while optimizing maintenance costs.

When designing intelligent manufacturing and quality control systems, an in-depth understanding of the technical characteristics of various industrial X-Ray systems is the cornerstone of enhancing product reliability and market competitiveness.