Wahfei Technology's in-line 3D Planar CT Automated X-ray Inspection (AXI) System acquires projection images through 360° rotational motion. By enabling real-time scanning coupled with on-the-fly 3D reconstruction, it rapidly obtains the complete dataset of the device under test (DUT). Arbitrary XY cross-sectional images can then be generated on demand for defect detection.

This system is optimized for inspecting electronic components such as BGA/LGA, press-fit connectors, Flip chips, PoP (Package-on-Package), QFN, PTH (Plated Through-Hole), and IGBTs. It detects internal defects including voids, open circuits, solder bridging, head-in-pillow effect, poor wetting, missing components, and incorrect component placement.