X-ray Inspection Audio Chip Solder Penetration Rate Video Demonstration

Solder Penetration Rate Inspection Standards and Requirements

Through-Hole Solder Joint Penetration Rate Standard

In the soldering process of audio chips, the solder penetration rate of through-hole joints is one of the key indicators for measuring soldering quality. According to industry standards (such as the IPC-A-610 Acceptability of Electronic Assemblies standard), the solder penetration rate for through-hole joints is typically required to reach 75% or higher. This means that the solder should penetrate from one side of the plated-through hole to the other, with a fill height not less than 75% of the printed circuit board thickness.

75-100%

Standard Through-Hole Joint

Optimal Soldering Quality Range

≥50%

Thermal Layer Through-Hole

Minimum Requirement for Thermal Layer Connection

A penetration rate between 75% and 100% is generally considered acceptable soldering quality. However, for plated-through holes connected to thermal layers or serving heat dissipation functions, where the thermal layer rapidly absorbs heat affecting solder fluidity and fill effectiveness, the penetration rate requirement is relatively more lenient, typically requiring 50% or higher.

Key Factors Affecting Solder Penetration Rate

It is important to note that specific penetration rate standards are not fixed but are influenced by a combination of factors:

Product Characteristics

Different types of audio products have varying requirements for signal transmission and electrical performance; professional-grade audio equipment typically demands higher penetration rate standards.

Usage Environment

Operating temperature range, humidity conditions, vibration, and shock directly impact the reliability requirements of solder joints.

Customer Requirements

Some high-end customers or special application scenarios may propose customized penetration rate requirements that exceed industry standards.

Industry Practice: In the actual production process of audio chips, to ensure high product quality and long-term reliability, manufacturers often establish internal inspection standards that are more stringent than general industry standards, based on their own process capability levels and quality control systems. This approach helps reduce product defect rates, enhance customer satisfaction, and build a technological advantage for the brand.

X-Ray Inspection Case Comparison

X-ray inspection technology (X-Ray Inspection) is a non-destructive testing method that can penetrate PCB substrates and components, clearly displaying the fill status of internal solder joints. Through X-Ray imaging, quality inspectors can accurately evaluate the solder penetration rate and identify soldering defects such as cold solder joints, voids, and bridging, ensuring each solder joint meets quality standards.

X-Ray Inspection Imaging

X-ray inspection of audio chip solder penetration rate

X-Ray inspection equipment's透视 imaging of audio chip solder joints

✓ Good Solder Penetration

Qualified Standard Characteristics

• Uniform and full solder fill
• Penetration height ≥75% board thickness
• No significant voids or cavities
• Smooth and rounded solder joint edges
• Reliable and stable electrical connection

✗ Poor Solder Penetration

Common Defect Types

• Insufficient solder fill
• Penetration height<75% board thickness
• Presence of large voids/cavities
• Potential risk of cold solder joints
• Impacts long-term reliability

Key Points of Quality Control

X-Ray inspection technology has become an indispensable quality control method in modern electronics manufacturing. For high-precision electronic products like audio chips, strictly controlling the solder penetration rate not only ensures the mechanical strength and electrical performance of the solder joints but also effectively prevents potential issues during product use such as sound quality degradation, signal interference, and even complete failure.

X-Ray Insights