In durian markets, opening a durian has long been likened to a "lucky dip": two durians that look virtually identical on the outside may differ dramatically once opened — in the number of flesh chambers, plumpness, and ripeness. The true value of the "King of Fruits" has remained hidden beneath a spiky, armored shell. Now, Wahfei is bringing industrial-grade 3D X-ray/CT inspection technology into durian quality control — revealing the internal structure without cutting or damaging the fruit, so the quality of every durian is plain to see before the shell is ever opened.

A business partner recently sent a batch of inductor samples to our laboratory for internal nondestructive imaging using the HF-S100 industrial X-Ray inspection system. Taking this real inspection as a starting point, this article systematically introduces the HF-S100's imaging capability and process adaptability for the typical defects encountered in inductor manufacturing — false joints, cold solder, open circuits, and uneven winding — and discusses the engineering value of its key modules: micro-focus X-Ray source, flat-panel detector, 60° tilt mechanism, and 360° rotating stage.

The HF-S90 industrial-grade X-Ray inspection equipment, independently developed by Huafei Technology (Wahfei), is equipped with a 90kV micro-focus sealed tube, 5μm focal spot size, and a high-resolution digital flat panel detector (FPD). Combined with a multi-angle NDT mechanism in which the X-ray source and FPD rotate concentrically up to 60°, it can perform one-pass internal structure imaging and dimensional measurement for BGA/QFN solder void rate, solder climb height, through-hole solder penetration, semiconductor packaging, lithium batteries, LEDs, heat pipes, and other products. It is widely used in 5G communications, automotive electronics, aerospace, electronic semiconductor packaging, SMT, connectors, wire harnesses, and other fields.

In the premium baijiu market, the value of a bottle of Moutai lies not only in the liquor itself, but also in its irreplaceable "identity." However, counterfeiting and quality defects—such as micro-drilling, refilling, and cap tampering—are eroding brand reputation in increasingly subtle ways. The Alcoholic Beverage X-ray Inspection System uses non-destructive penetrative imaging to reveal the internal structure of every bottle on screen, making it a critical component of quality control and anti-counterfeiting traceability systems for distilleries.

Products are getting smaller and their structures are becoming more and more complex - defects such as solder joints, bubbles, foreign objects, misalignment, and internal cracks, hidden inside the products, are invisible to the naked eye. By the time customers complain and bulk returns occur, irreversible losses have often been incurred. The Huafei HF-S90 is an industrial X-Ray inspection device specifically designed to address this pain point. Through non-destructive fluoroscopy imaging, it intuitively displays every detail inside the product on the screen, allowing the quality control team to make rapid and accurate quality judgments without dismantling or damaging the product.

The penetrating power of X-rays makes them highly sensitive to density differences between metals and non-metals. In heating wire inspection, X-ray inspection systems can produce clear images and reliably detect the following types of defects:Core eccentricity / wire center offset-Broken wire / break points-Porosity / voids-Uneven winding pitch-Foreign material contamination-Joint defects-Cold solder joints or voids inside welded/crimped terminations-Unstable contact resistance …

In the manufacturing of wire harnesses, cables, and connectors, many defects that affect product reliability are hidden within the internal structure. Traditional visual inspection cannot observe these internal conditions, while destructive cross-sectioning fails to meet the demands for efficiency and mass quality management. Industrial X-Ray inspection technology utilizes high-penetration imaging to perform high-definition internal analysis of key areas—such as conductors, crimps, soldering, pins, injection molding, and insulation—without damaging the product, achieving true non-destructive testing (NDT).

Compared to other traditional nondestructive testing methods, the greatest advantage of industrial CT is that the images it produces are free from interference caused by overlapping internal structures. This means it can do much more than just "look inside"—it addresses the following in-depth challenges:Unrestricted defect detection from all angles-Destructive-free internal measurement-Assembly integrity verification — inspecting the positioning and engagement of internal components without disassembling the entire machine or sealed parts

The newly introduced industrial X-ray inspection system uses penetrating X-rays to perform non-contact imaging of the control module, clearly revealing the internal structure of every BGA solder ball and every through-hole solder joint. This means the starting point of quality control has shifted from final electrical verification to the moment the internal structures are formed.

For FPC flexible boards with multi-area, large-area wiring and micro-SMT components, Inline X-Ray equipment can automatically move the inspection platform (X/Y axes) or adjust the X-Ray tube angle through preset CNC inspection programs to implement comprehensive inspection of different key areas (ROI) on the flexible board without blind spots.

leveraging advanced x-ray fluoroscopic imaging technology combined with intelligent image algorithms, we transform the previously “blind-box-like” bga soldering quality—undetectable by the naked eye and conventional instruments—into clearly visible and precisely quantified reports. this not only helps manufacturers quickly intercept defective products from entering the market, but also enables reverse tracking of void ratio trends to guide continuous optimization of front-end smt placement machines and reflow soldering process parameters, thereby improving yield at the source and establishing a solid quality safeguard for the long-term reliability of customer products.

In consumer electronics, automotive electronics, and communication equipment, BGA (Ball Grid Array) has become a mainstream packaging method due to its high interconnect density and excellent electrical and thermal performance. However, BGA solder balls are completely hidden beneath the package, making them inaccessible to visual inspection and AOI. X-ray inspection systems utilize X-ray penetration to provide real-time, non-destructive, and clear visualization of internal BGA solder joints, making them essential for ensuring soldering quality. Wahfei’s self-developed X-ray inspection equipment, featuring ultra-high resolution and advanced image processing, delivers precise and reliable solutions for BGA inspection.