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Selection Guide for Industrial X-Ray Non-Destructive Testing Instrument HF-S90: Value Proposition for Purchase
Pubdate 2026-07-31

Huafei HF-S90 90kV Micro-Focus · 60° Multi-Angle Tilt · BGA/QFN Solder Joint Inspection Solution

The HF-S90 industrial-grade X-Ray inspection equipment, independently developed by Huafei Technology (Wahfei), is equipped with a 90kV micro-focus sealed tube, 5μm focal spot size, and a high-resolution digital flat panel detector (FPD). Combined with a multi-angle NDT mechanism in which the X-ray source and FPD rotate concentrically up to 60°, it can perform one-pass internal structure imaging and dimensional measurement for BGA/QFN solder void rate, solder climb height, through-hole solder penetration, semiconductor packaging, lithium batteries, LEDs, heat pipes, and other products. It is widely used in 5G communications, automotive electronics, aerospace, electronic semiconductor packaging, SMT, connectors, wire harnesses, and other fields.

I. Product Overview

The HF-S90 is a new-generation X-Ray inspection equipment launched by Shenzhen Huafei Technology Co., Ltd. to address the demand for high-precision, high-efficiency industrial non-destructive testing. The equipment is built on an imaging chain comprising a micro-focus sealed X-ray tube and a high-resolution digital flat panel detector, combined with a six-axis linkage control system and Huafei's independently developed multi-functional image processing system. It can clearly reveal internal solder joints, voids, cracks, traces, and other micro-structures of PCBAs, semiconductor packages, lithium batteries, connectors, and other products without damaging them.

Compared with traditional 2D X-Ray, the HF-S90 employs a multi-angle mechanism with concentric rotation of the X-ray source and FPD, swinging the X-ray tube and detector as a single rigid body from 0° to 60° while keeping the stage horizontal. This fundamentally resolves industry pain points such as "compressed inspection range and image distortion once the angle changes," making it particularly suitable for rapid imaging of 3D BGA/QFN solder morphology, solder climb height, gold wire arc, and other spatial geometric features.

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Figure 1 · HF-S90 overall appearance: enclosed shielding chamber, 24-inch widescreen industrial monitor, optional 360° rotary stage, multi-step six-axis linkage control console. Overall weight approx. 1200 kg; dimensions 1314×1520×1670 mm.

II. Core Features

1. Independently Developed Multi-Functional Image Processing System

The HF-S90 is equipped with Huafei Technology's independently developed multi-functional image processing software. The interface supports one-click Chinese-English switching and integrates features such as one-click navigation, real-time position tracking, NG/OK step annotation, void rate / three-point diameter / parallel distance / polygon measurement, and arrow and text annotations. The software adopts a three-level permission management system (administrator, engineer, operator) to effectively prevent misoperation and production process leakage.

For multi-product batch inspection scenarios, the HF-S90 provides multi-point CNC editing and positioning: up to ≥1000 test point position programs can be saved for a single product. Subsequent calls automatically execute positioning and testing per the program, with two selectable modes: "interval-timed positioning" or "advance to next point after operator NG/OK judgment," eliminating missed inspections.

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Figure 2 · The 24-inch widescreen monitor displays real-time BGA solder joint X-ray images. Combined with the independently developed software, one-click automatic navigation, positioning, measurement, and judgment can be completed.

2. Optional Stage Horizontal 360° Rotation

The HF-S90 comes standard with a 600×600 mm flat stage with a maximum load capacity of 10 kg. With the optional 360° horizontal rotary stage (Φ550 mm), the inspected sample can be rotated horizontally at a uniform speed without lifting the product or changing the X-ray incidence angle. This facilitates inspection of circumferential defects in axially symmetric devices (such as cylindrical lithium batteries, capacitors, and connectors), and can be used in conjunction with the 60° tilt function to observe solder joint morphology from any angle.

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Figure 3 · Optional 360° rotary stage demonstration: carbon fiber stage plate with lightweight design, PCBA sample rotating smoothly. Combined with the concentric X-ray source + FPD tilt, imaging from any spatial orientation is achievable.

3. Concentric 60° Tilt Inspection — X-ray Source + FPD

To observe side solder joint morphology, traditional X-Ray inspection typically either "tilts the stage" (posing product drop risk, altering the inspection range, and risking collision between the X-ray source and the platform) or "tilts only the detector" (causing intensity attenuation and image distortion). The HF-S90 adopts the third-generation multi-angle inspection mechanism: the X-ray source and FPD swing concentrically as a single rigid body from 0° to 60°, while the platform remains horizontal and the central X-ray beam always targets the inspection area — no distortion, no energy loss, no compressed inspection range.

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Figure 4 · 60° multi-angle tilt mechanism at its limit position: the X-ray tube and FPD move in sync while the stage remains horizontal. The inspected product is never at risk of falling.

4. Auto Return and One-Click Navigation

To reduce efficiency loss from repetitive positioning, the HF-S90 provides auto return and one-click navigation: saved test points can be recalled with one click, and the software displays the current stage position coordinates and deviation from the target point in real time. Combined with the six-axis linkage control system, positioning is completed quickly and accurately, reducing single-point positioning time by over 60% compared to manual operation.

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Figure 5 · One-click navigation + auto return: the software automatically calculates the shortest path and drives the six-axis linkage system for precise positioning, significantly reducing operator workload.

5. Multi-Type Measurement Functions

The HF-S90 software includes a complete set of measurement tools that can be used directly on X-ray images: distance measurement, diameter measurement, void ratio calculation, solder climb height measurement, parallel distance measurement, polygon area measurement, and more. Measurement results support arrow annotations and text notes for convenient inspection report archiving and traceability.

Industry Pain Point: In high-reliability fields such as 5G communications and automotive electronics, a BGA solder joint void rate exceeding 25% is judged as non-conforming. The HF-S90's automatic void rate calculation and multi-point CNC program can complete judgment of hundreds of solder joints on a full board within 3–5 minutes, serving as a key guarantee for production line cycle time and quality closed-loop control.

III. Multi-Angle Inspection Mechanism Principle

The HF-S90's multi-angle inspection mechanism is a key upgrade over the previous two generations. Understanding its principle helps evaluate whether it truly suits your products during the selection phase:

  • First Generation (Stage Tilt Solution): The stage tilts together with the product. The advantage is simple mechanical structure; the disadvantages are that the product must be securely fixed to prevent drop risk, the inspection range is compressed as the angle increases, and there is a collision hazard between the X-ray source and the tilted platform.

  • Second Generation (Detector-Only Tilt): The X-ray tube remains stationary; only the detector follows the product angle. The advantage is that the platform stays horizontal; the disadvantage is that as the detector tilts, the X-ray deviates from the central axis, causing significant energy attenuation, image distortion, and degradation.

  • Third Generation (HF-S90 Solution): The X-ray source and FPD swing concentrically as a rigid body, with the platform remaining horizontal. The inspected product is always on the central axis of the X-ray source — no intensity loss, no distortion, no compressed inspection range, no collision risk between the source and platform, and no special product fixturing required.

Combined with the optional 360° horizontal stage rotation, the HF-S90 enables "tilt + circumferential" dual-DOF compound observation of cylindrical lithium batteries, axially symmetric connectors, and other products without changing fixtures — an efficient approach for 3D defect localization and multi-cross-section analysis.

IV. Typical Application Fields

Thanks to its 90kV / 5μm imaging specifications and multi-angle mechanism, the HF-S90 has become a standard configuration in the following industry scenarios:

5G Communications

Base station filters, RF module BGA/AiP package solder morphology and void rate inspection.

Automotive Electronics

ECU control units, IGBT modules, automotive-grade BGA solder joint reliability analysis.

Aerospace

High-reliability PCB and military-grade component solder joint internal defect screening.

Semiconductor Packaging

QFN/BGA/CSP/WLCSP solder ball arrays, gold wire arc, mold compound internal lead inspection.

SMT — BGA/QFN

Post-reflow solder void rate, bridging, cold solder, climb height judgment.

LED

LED substrate internal gold wire, die-attach layer, phosphor distribution inspection.

Connectors / Wire Harnesses

Connector solder pin penetration, wire harness crimp terminal internal structure imaging.

Lithium Batteries / Supercapacitors

Cylindrical/prismatic lithium battery electrode stack alignment, tab welding quality, capacitor winding defect inspection.

Molded Plastic Parts

Metal insert position, internal void and crack non-destructive evaluation.

V. Radiation Safety and Interlock

The HF-S90 undergoes radiation dose testing and safety interlock validation before leaving the factory. Key indicators are as follows:

  • X-ray Leakage: < 1 μSv/h, complying with national industrial radiographic health standards for dose limits for the public and workers.

  • Triple-Door Safety Interlock:

    1. X-ray cannot start when the door is not properly closed;

    2. The front door auto-locks when X-ray is active and cannot be opened;

    3. If the door is forcibly opened during X-ray operation, the X-ray is forced to shut down before the door opens, eliminating instantaneous exposure risk.

  • Top Status Indicator: During X-ray operation, the three-color tower light is solid red, accompanied by an "X-RAY" label on the exterior of the cabinet, complying with international radiation warning conventions.

Huafei Technology provides one-stop service for the HF-S90 — from delivery and training to long-term operation and maintenance:

Delivery, Installation and Commissioning

The equipment is delivered directly by Huafei Technology to the customer's designated location, with free on-site installation and commissioning until the equipment passes customer acceptance.

Training System

During installation, Huafei Technology arranges engineers to conduct 2–4 days of on-site operational training at the customer's facility. The training content covers two tracks:

  • Operators / Process Technicians: Equipment structure and working principles, operating procedures, parameter settings, tools and accessories usage, common fault phenomena and troubleshooting.

  • Maintenance Personnel / Process Engineers: In-depth working principles, process principles, typical failure mode analysis, maintenance methods.

After-Sales Service Commitment

  • 365 days × 24 hours professional and timely after-sales service, responding quickly to customer needs via phone, remote support, on-site visits, and other methods.

  • Dedicated after-sales personnel + comprehensive spare parts supply system, ensuring shortest recovery time for equipment failures.

  • The complete machine undergoes rigorous quality inspection before leaving the factory, with full-process packaging and transportation protection.

FAQ

QIs the software independently developed by Huafei?

AYes. The equipment is equipped with Huafei Technology's independently developed multi-functional image processing system, supporting one-click Chinese-English switching, multi-point CNC editing (>1000 test points), NG/OK step annotation, void rate / three-point diameter / parallel distance / polygon measurement, and more.

QWhat are the advantages of the HF-S90 compared to similarly priced 2D X-Ray equipment?

AThe core advantage lies in the combination of the third-generation multi-angle mechanism and the high-resolution FPD: within the 60° tilt range, the image is free of distortion, energy attenuation, and inspection range compression. Combined with the 1536×1536 pixel matrix and 85μm pixel size, it can present 3D morphological information of BGA solder joints in a single pass — something 2D equipment cannot achieve.

QIs free sample testing supported?

AYes. Huafei Technology offers free sample testing services. Customers can send typical products to the Huafei laboratory, where engineers will provide a preliminary imaging report and feasibility assessment.

About Shenzhen Huafei Technology Co., Ltd.: Huafei Technology (Shenzhen Wahfei Technology Co., LTD) is a high-tech enterprise specializing in the R&D and production of X-ray inspection equipment. Its products are widely used in 5G communications, aerospace, electronic semiconductor packaging, SMT, LED, connectors, wire harnesses, lithium batteries, supercapacitors, and other fields, and it has established industry-academia-research collaborations with multiple well-known domestic universities.

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