Industrial X-Ray Inspection for LED Eutectic Solder Bridging
- Pubdate 2025-12-29
Seeing Through LEDs: How to Precisely Detect Solder Bridging in Eutectic Bonding?
Improving yield starts with revealing details invisible to the human eye.
In LED packaging processes, eutectic bonding is widely used due to its superior thermal performance and reliability. However, as chip sizes continue to shrink, process complexity increases exponentially. Solder bridging can cause short circuits, while voiding results in thermal dissipation failure. These defects, hidden beneath the chip interface, are the primary contributors to long-term product failure.
When facing micron-level internal defects, high-penetration and high-resolution X-Ray inspection technology becomes the frontline defense for ensuring outgoing quality.
Why Choose X-Ray Inspection for LED Eutectic Bonding?
✔Non-destructive penetration: Inspect beneath the chip interface without damaging the sample, clearly visualizing solder distribution.
✔Solder bridging detection: Automatically identifies solder overflow and adjacent pad connections to eliminate short-circuit risks.
✔Void ratio analysis: Intelligent software calculates void percentages to ensure thermal paths meet automotive-grade and industrial standards.
Defect Imaging: Capturing Micron-Level Solder Bridging NG
In accordance with commercial confidentiality agreements and respect for partner intellectual property, the X-Ray images shown here are for technical capability demonstration only.
Wahfei invites you to submit or send samples to experience real inspection performance firsthand.
Concerned About Hidden Soldering Defects in Your LED Products?
Instead of guessing, verify with real inspection. We provide professional testing solutions and detailed X-Ray imaging reports.
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