X-ray Determination of Common Defects and Countermeasures: Insufficient Solder Penetration (Shallow Fill): Increase preheat, adjust wave contact angle and time, optimize hole wall cleanliness. Internal Voids/Gas Entrapment: Reduce solder gas content, optimize flux volatilization path and nitrogen protection. Eccentric Wetting: Check pin centering and fixture positioning, perform hole chamfering/expand ring width if necessary.

X-rays possess extremely strong penetrating power. Different material densities and thicknesses absorb X-rays to varying degrees. By analyzing the intensity changes of X-rays after passing through a sample, grayscale contrast images are formed to identify internal structures. Based on material density characteristics, PCBA components can be divided into four categories: tin-lead alloy solder joints (high density, appear dark in images); metal packaging shells, ceramic packaging, chips (medium density); plastic packaging materials, silicon materials (low density, appear light in images); void, crack defects and PCB vias (X-rays pass through completely, appear brightest).

With the accelerated adoption of third-generation semiconductors like silicon carbide (SiC) and gallium nitride (GaN), alongside the boom in new energy vehicles, photovoltaic energy storage, and AI data centers, the industry's demand for efficient and precise chip testing is continuously growing. From July 25th to 27th, 2025, the 19th China Semiconductor Discrete Devices Conference & Exhibition was held under the industry's spotlight. Wahfei Technology made a significant appearance, showcasing its independently developed full-stack X-Ray intelligent inspection solutions.