The open-tube microfocus X-ray, serving as the core component of precision X-ray inspection equipment, resolves this critical challenge. Its technical advantages are manifested in: ultra-high precision, high optical magnification, and high reliability. Maintainability: the open-tube design permits users to replace consumables such as filaments themselves, effectively reducing long-term operational costs. Open-tube microfocus X-ray technology, as the core component of precision X-ray inspection equipment, resolves this critical challenge. Its technical advantages are manifested in: ultra-high precision, high optical magnification, exceptional reliability, and maintainability. The open-tube design permits users to replace consumables such as filaments themselves, effectively reducing long-term operational costs.

The demonstration video of PCBA X-ray inspection reveals that X-ray inspection equipment is not merely a tool for visualisation, but also a vital diagnostic apparatus that quantifies defects and integrates them into standardised processes.

As a critical flexible connector in industrial piping systems, the weld quality of bellows directly impacts the safety and reliability of the entire system. This paper will delve into how X-ray non-destructive testing technology can be utilized to accurately identify potential defects in the longitudinal welds and end joint connections of bellows.

In electronic manufacturing, SMT incoming inspection, and semiconductor packaging processes, X-Ray inspection equipment does more than simply “see inside structures.” It directly affects material counting accuracy, inspection efficiency, and the stability of downstream processes. To address the issues of low efficiency, high error rates, and the inability of traditional manual counting to simultaneously detect internal defects, integrated X-Ray solutions that combine material counting and inspection are increasingly becoming standard equipment for many enterprises.

In the electronics manufacturing industry, the detection of internal product defects has always been a crucial part of quality control. Traditional 2D X-Ray inspection can only provide a flat projection, making it impossible to accurately locate the three-dimensional position of defects. The emergence of microfocus X-Ray CT tomography and 3D reconstruction technology has completely changed this scenario—it can reveal the internal structure of products layer by layer, much like "slicing a watermelon," exposing hidden defects such as solder voids, cracks, and foreign objects that were previously undetectable.

Covering IGBTs / PCBA / connectors / semiconductor packages / lithium batteries / wires / LEDs / diamonds / heat pipes, etc.

Can't inspect hidden solder joints? X-Ray inspection is your final quality gate. Learn how it visualizes BGA balls, measures voiding, and prevents costly escapes in network, security, and industrial control hardware before shipment.

Simple operation allows even non-technical users to get started quickly. One-click detection identifies internal defects such as BGA solder joint failures, IGBT bubbles, and PCB solder bridges. Boost inspection efficiency with MES system integration to reduce scrap rates and labor costs.

Unlike the stacking effect of conventional radiographic images, 3D CT (Computed Tomography) technology uses 360-degree rotational imaging combined with algorithmic reconstruction to perform “layer-by-layer slicing” analysis of SiC wafers and power devices with micron-level precision.

In high-end LED packaging processes, eutectic bonding is widely adopted for its excellent thermal conductivity and long-term reliability. However, as chip dimensions continue to shrink, process control becomes exponentially more challenging. Solder bridging can cause electrical short circuits, while voiding leads to thermal dissipation failure. These defects, hidden beneath the chip interface, are among the primary causes of latent product failure. When dealing with micron-level internal defects, high-penetration, high-resolution X-Ray inspection technology becomes the critical safeguard for outgoing product quality.

Wahfei's X-Ray inspection system is specifically designed for this purpose. The system offers real-time, off-axis X-Ray imaging, specially tailored for the inspection of PCBA (Printed Circuit Board Assembly) and array-type devices. It is suitable for use both in production lines and in failure analysis laboratories. The sample can be rotated 360° and supports large tilt viewing angles; combined with an intuitive software interface, it enables operators to clearly observe and identify even the most challenging defect types.

For products such as SMD and FPC assemblies with complex structures and hidden solder joints,industrial X-ray inspection is no longer just a supplementary quality control method.It can be integrated as a core inspection process, enabling manufacturers to identify internal soldering defects before shipment and effectively reduce hidden quality risks.