Simple operation allows even non-technical users to get started quickly. One-click detection identifies internal defects such as BGA solder joint failures, IGBT bubbles, and PCB solder bridges. Boost inspection efficiency with MES system integration to reduce scrap rates and labor costs.

Unlike the stacking effect of conventional radiographic images, 3D CT (Computed Tomography) technology uses 360-degree rotational imaging combined with algorithmic reconstruction to perform “layer-by-layer slicing” analysis of SiC wafers and power devices with micron-level precision.

In high-end LED packaging processes, eutectic bonding is widely adopted for its excellent thermal conductivity and long-term reliability. However, as chip dimensions continue to shrink, process control becomes exponentially more challenging. Solder bridging can cause electrical short circuits, while voiding leads to thermal dissipation failure. These defects, hidden beneath the chip interface, are among the primary causes of latent product failure. When dealing with micron-level internal defects, high-penetration, high-resolution X-Ray inspection technology becomes the critical safeguard for outgoing product quality.

Wahfei's X-Ray inspection system is specifically designed for this purpose. The system offers real-time, off-axis X-Ray imaging, specially tailored for the inspection of PCBA (Printed Circuit Board Assembly) and array-type devices. It is suitable for use both in production lines and in failure analysis laboratories. The sample can be rotated 360° and supports large tilt viewing angles; combined with an intuitive software interface, it enables operators to clearly observe and identify even the most challenging defect types.

For products such as SMD and FPC assemblies with complex structures and hidden solder joints,industrial X-ray inspection is no longer just a supplementary quality control method.It can be integrated as a core inspection process, enabling manufacturers to identify internal soldering defects before shipment and effectively reduce hidden quality risks.

Traditional inspection methods often rely on manual sampling or destructive unpacking. This is not only inefficient but also fails to cover every product leaving the factory. Especially for items with composite plastic and metal packaging, such as lipsticks and liquid lip tints, how to inspect the internal condition without opening, touching, or damaging the exterior has become an industry pain point. This is exactly where modern industrial X-ray inspection equipment comes into play. Leveraging the strong penetrative power and density resolution of X-rays, we can conduct a thorough “CT scan” of each product, examining it from the inside out.

Random sampling, prototyping, first article inspection (FAI), and mold geometry optimization each have distinct inspection objectives requiring different types of analysis. X-ray CT systems and high-quality standard X-ray solutions deliver a wide range of results.

In the semiconductor manufacturing sector, wafers serve as the cornerstone of chip production. Their microscopic defects—such as scratches, cracks, or internal voids—often lie hidden beneath the surface, where even minor oversights can render an entire batch of products unusable. Industrial X-ray wafer inspection technology, with its non-contact, non-destructive, and high-resolution capabilities, emerges as the solution.

The internal structure of chips is highly intricate, with diverse packaging forms and complex manufacturing processes. For IDMs, packaging and testing facilities, solution designers, and end-brand manufacturers alike, the core requirement in quality management and reliability verification has become the rapid and accurate detection of packaging defects and process risks without damaging the devices. Against this backdrop, X-Ray non-destructive testing equipment has emerged as a vital tool for packaging quality control and failure analysis (FA).

X-Ray Testing System Real-Time Imaging Interface / High-Resolution X-Ray Imaging Clearly Reveals FPC Internal Structure

During the production of injection‑molded parts and metal power enclosures, foreign object contamination is often hidden and unpredictable, impacting both yield and safety. With high‑resolution imaging technology, metallic debris, plastic residue, assembly omissions, and other internal defects can be precisely located without cracking or damaging the sample structure, helping manufacturers identify risks in time and maintain stable production quality.

In the fields of electronics manufacturing, integrated circuit packaging, automotive parts, and precision casting inspection, X-Ray equipment has become a critical tool for quality control. However, many companies focus excessively on hardware parameters when purchasing equipment, while overlooking a core fact: under the same shooting conditions, image processing technology is the key factor that determines inspection results.